Broadcom Lines Up $60 Billion Debt Package to Fund Anthropic AI Chips
Broadcom and a banking syndicate are lining up $60 billion in fresh to finance chips and infrastructure for customers including Anthropic. Banks are preparing syndication letters for a $42 billion Class A senior-secured tranche, while Blackstone is leading an $18 billion Class B junior debt tranche with a $9 billion personal commitment. The new borrowings arrive as Broadcom agrees to lend Anthropic up to $42 billion to fund roughly one-third of a five-year, $125.2 billion lease commitment for tensor processing unit computing capacity. That dual role makes Broadcom both the chip supplier and the lender, concentrating credit and operational risk on a single client expected to become its largest XPU customer in 2027. The $60 billion package would nearly double Broadcom's total debt from the $66.5 billion carried at the end of fiscal 2025. That debt reduction followed a prior-period jump to $68.9 billion in fiscal 2024 after the VMware , though net debt stood at about $35.4 billion alongside $24.0 billion in cash and short-term investments. Cash from operations reached $14.2 billion in the quarter ended August 2 against $532 million of . Analysts expect Broadcom's to rise from $63.9 billion in fiscal 2025 to $106 billion in fiscal 2026, and eventually reach $272 billion by fiscal 2028. Anthropic's prospectus warns of potential conflicts of interest arising from Broadcom's dual position, noting that defaults could accelerate lease obligations and restrict access to the credit line. Anthropic is reportedly considering an initial public offering as early as mid-November.